作者: Johnny K. O. Sin , Yong Liu , Yuichi Onozawa , Naoto Fujishima , Chao Xiao
关键词: Thermal stability 、 Annealing (metallurgy) 、 Gate dielectric 、 Gate oxide 、 Silicon carbide 、 Materials science 、 Dielectric 、 Deposition (law) 、 Analytical chemistry 、 Electric field
摘要: We fabricated Al2O3/LaAlO3/SiO2 (ALS) gate stacks on 4H-SiC, with LaAlO3 (LAO) film being annealed in O2 atmosphere. The ALS stack at 700 °C exhibits a much higher breakdown effective electric field ( ${E}_{\text {eff}}$ ), which is approximately 1.8 times than that of traditional SiO2 oxide. also yields low interface state density ${D}_{\text {it}}$ ) thanks to the intact LAO film. However, an annealing temperature as high 800 induced traps and deteriorated SiO2–SiC interface. °C-annealed dielectric constant $\kappa $ 14 trap density, coupled good electrical characteristics, makes it promising for SiC power metal-oxide-semiconductor (MOS) device applications.