Processing method of microelectronic mechanical system
作者： Li Xiaoming , Zhang Anna
DOI:
关键词: Substrate (electronics) 、 Microelectronics 、 Optoelectronics 、 Edge (geometry) 、 Etching (microfabrication) 、 Photoresist 、 Ultraviolet 、 Aperture 、 Materials science 、 Layer (electronics)
摘要: The invention discloses a processing method of microelectronic mechanical system, which comprises the following steps: forming substrate layer on silicon chip; photoresist pattern layer; heating whole chip and performing ultraviolet ray irradiation treatment; then etching by dry method. By treatment irradiation, anti-etching capability is enhanced method, so that problem side edge excessively corroded in prior art size micro structure large can be avoided. aperture ensure consistency.
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