Integrated circuit substrate having laminated laser-embedded circuit layers

摘要: An integrated circuit substrate having laminated laser-embedded layers provides a multi-layer high-density mounting and interconnect structure for circuits. A prepared substrate, which may be rigid double-sided dielectric or film with conductive patterns plated, etched printed on one both sides is thin-film sides. The laser-ablated to form channels via apertures material plated paste screened into the apertures, forming pattern that isolated by channel vias through substrate. die external terminals can then attached providing an interconnect.