Semiconductor device and method for manufacturing substrate of the same
作者： Makoto Iijima , Muneharu Morioka , Masaru Nukiwa , Seiji Ueno
DOI:
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摘要: A semiconductor device includes a multi-flexible substrate and chips mounted thereon. The is configured such that organic insulation layers filmy adhesive are alternatively stacked together wiring formed therein interconnected by means of vias. Each the vias consisting via-hole which penetrating both metal via member 26 provided in made an identical material. method manufacturing for also disclosed.
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