Multilayer printed circuit board and manufacture thereof

作者: Takao Iriyama , Osamu Fujikawa , Kenro Kimata

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摘要: PURPOSE:To obtain a multilayer printed circuit board, capable of enhanced integration density and simple in structure, by method wherein step is formed near an opening provided the surface substrate that outermost plurality substrates. CONSTITUTION:A 10 with mount 11 for accommodating electronic part 20 conductor 15, another positioned on said to serve as layer, further or more 12 corresponding are placed under pressure bondage through intermediary adhesive layers 14. A throughholes 16 simultaneously penetrate each substrates 16a inside through-holes 16. 15 10. On now bonded together necessary circuits 13 surrounding produced.

参考文章(1)
Yamazaki Masafumi, MULTILAYER CIRCUIT BOARD ,(1985)