Sputter deposition and annealing of copper alloy metallization M
作者： Barry Chin , Bingxi Sun , Imran Hashim , Peijun Ding , Tony Chiang
DOI:
关键词: Sputter deposition 、 Annealing (metallurgy) 、 Copper 、 Electroplating 、 Metallurgy 、 Wafer 、 Materials science 、 Copper plating 、 Aluminium 、 Oxide
摘要: Copper and a small amount of an alloying metal such as magnesium or aluminum are cosputtered onto substrate having oxide on at least portion its surface. Either the wafer is held elevated temperature during deposition sputtered film annealed without being exposed to ambient. Due high temperature, diffuses If surface low partial pressure oxygen contacts silicon dioxide, forms thin stable oxide. The encapsulates copper layer provide barrier against migration, form adhesion over act seed for later growth copper, example, by electroplating.
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