Wet cleaning of chamber component
作者： Juan Carlos Rocha-Alvarez , Sanjeev Baluja , Inna Turevsky , Daemian Raj , Ren-Guan Duan
DOI:
关键词: Chemical engineering 、 Chemistry 、 Polishing 、 Wet cleaning 、 Ultrasonic sensor 、 Chromatography
摘要: Embodiments of the invention generally provide methods for cleaning a UV processing chamber component. In one embodiment, method component includes soaking having SiCO residue formed thereon in solution about 1 to 10 minutes. The comprises 5% by weight 60% NH4F and 0.5% 10% HF. also polishing another fabricated from quartz comprising 36% HF 3 applying an ultrasonic power solution, mechanically
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