作者: Michael P. Chudzik , Huiming Bu , William K. Henson , Naim Moumen , Wesley C. Natzle
DOI:
关键词: Titanium nitride 、 Electronic engineering 、 Metal gate 、 Gate oxide 、 Substrate (electronics) 、 Dielectric 、 Materials science 、 Silicon 、 Optoelectronics 、 High-κ dielectric 、 Gate dielectric
摘要: Methods for fabricating gate electrode/high-k dielectric structures having an improved resistance to the growth of silicon dioxide (oxide) at dielectric/silicon-based substrate interface. In embodiment, a method forming transistor structure comprises: incorporating nitrogen into silicon-based proximate surface substrate; depositing high-k across and electrode form structure. one comprises titanium nitride rich in inhibiting diffusion oxygen.