Method for joining an integrated circuit
作者： Chris M. Schreiber , Haim Feigenbaum
DOI:
关键词: Stress (mechanics) 、 Electrical engineering 、 Electrical connection 、 Integrated circuit 、 Reliability (semiconductor) 、 Engineering
摘要: A method for attaching an integrated circuit to a flexible which includes the acts of providing having plurality contact pads formed upon surface thereof; possessing bumps integral area; and by fusing at least some circuit. The have shape mitigates local stress buildup within after attachment pads, so as enhance reliability electrical connection.
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