Process chamber apparatus, systems, and methods for controlling a gas flow pattern
作者： Chandrakant M. Sapkale , Izya Kremerman , Jeffrey C. Hudgens , Nir Merry
DOI:
关键词: Flow control (fluid) 、 Volumetric flow rate 、 Electrical engineering 、 Flow pattern 、 Materials science 、 Mechanical engineering
摘要: Process chamber gas flow control apparatus may include, or be included in, a process configured to substrate therein. The include valve seal an exhaust port in the chamber. moveable X, Y, and Z directions relative adjust pattern (including, e.g., rate and/or uniformity) within Methods of adjusting are also provided, as other aspects.
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