作者: Haining S. Yang , Chih-Chao Yang
DOI:
关键词: Materials science 、 Composite material 、 Trench 、 Fuse (electrical) 、 Compressive strength 、 Substrate (printing)
摘要: A semiconductor fuse and methods of making the same. The includes a element compressive stress liner that reduces electro-migration resistance element. method forming substrate, trench feature in depositing material feature, over material, patterning material.