Elasto-viscoplastic nonlocal damage modelling of thermal fatigue in anisotropic lead-free solder
作者： R.L.J.M. Ubachs , P.J.G. Schreurs , M.G.D. Geers
DOI: 10.1016/J.MECHMAT.2006.11.001
关键词: Finite element method 、 Anisotropy 、 Grain boundary 、 Composite material 、 Viscoplasticity 、 Materials science 、 Thermal expansion 、 Temperature cycling 、 Structural engineering 、 Soldering 、 Stress concentration 、 Instrumentation (computer programming) 、 General Materials Science 、 Mechanics of Materials
摘要: … The simulation of the thermal cycling process using viscoplastic material behaviour, but excluding damage, revealed a steady state distribution of the field variables to arise after only a …
narcis.nl
elsevier.com
core.ac.uk 参考文章(49)
Jerrold E. Marsden, Thomas J. R. Hughes, D. E. Carlson, Mathematical foundations of elasticity ,(1982)
M.R. Harrison, J.H. Vincent, H.A.H. Steen, Lead‐free reflow soldering for electronics assembly Soldering & Surface Mount Technology. ,vol. 13, pp. 21- 38 ,(2001) , 10.1108/09540910110407388
W. J. Plumbridge, C. R. Gagg, S. Peters, The creep of lead-free solders at elevated temperatures Journal of Electronic Materials. ,vol. 30, pp. 1178- 1183 ,(2001) , 10.1007/S11664-001-0147-3
Tia-Marje K. Korhonen, Pekka Turpeinen, Lawrence P. Lehman, Brian Bowman, George H. Thiel, Raymond C. Parkes, Mattt A. Korhonen, Donald W. Henderson, Karl J. Puttlitz, Mechanical properties of near-eutectic Sn-Ag-Cu alloy over a wide range of temperatures and strain rates Journal of Electronic Materials. ,vol. 33, pp. 1581- 1588 ,(2004) , 10.1007/S11664-004-0101-2
Jeffrey C. Suhling, H.S. Gale, R. Wayne Johnson, M. Nokibul Islam, Tushar Shete, Pradeep Lall, Michael J. Bozack, John L. Evans, Ping Seto, Tarun Gupta, James R. Thompson, Thermal cycling reliability of lead‐free chip resistor solder joints Soldering & Surface Mount Technology. ,vol. 16, pp. 77- 87 ,(2004) , 10.1108/09540910410537354
Masazumi Amagai, Masako Watanabe, Masaki Omiya, Kikuo Kishimoto, Toshikazu Shibuya, Mechanical characterization of Sn–Ag-based lead-free solders Microelectronics Reliability. ,vol. 42, pp. 951- 966 ,(2002) , 10.1016/S0026-2714(02)00017-3
W. M. Wang, L. J. Sluys, R. de Borst, Viscoplasticity for instabilities due to strain softening and strain‐rate softening International Journal for Numerical Methods in Engineering. ,vol. 40, pp. 3839- 3864 ,(1997) , 10.1002/(SICI)1097-0207(19971030)40:20<3839::AID-NME245>3.0.CO;2-6
George Z. Voyiadjis, Rashid K. Abu Al-Rub, Anthony N. Palazotto, Thermodynamic framework for coupling of non-local viscoplasticity and non-local anisotropic viscodamage for dynamic localization problems using gradient theory International Journal of Plasticity. ,vol. 20, pp. 981- 1038 ,(2004) , 10.1016/J.IJPLAS.2003.10.002
A. A. Telang, T. T. Bieler, S. Choi, K. K. Subramanian, Orientation imaging studies of Sn-based electronic solder joints Journal of Materials Research. ,vol. 17, pp. 2294- 2306 ,(2002) , 10.1557/JMR.2002.0337
R.H.J. Peerlings, T.J. Massart, M.G.D. Geers, A thermodynamically motivated implicit gradient damage framework and its application to brick masonry cracking Computer Methods in Applied Mechanics and Engineering. ,vol. 193, pp. 3403- 3417 ,(2004) , 10.1016/J.CMA.2003.10.021