Laser diode assembly

作者: Jon B. Jacob , Brian P. Hoden

DOI:

关键词: Laser diodeHeat spreaderOptoelectronicsElectrical connectionDiodeElectrical conductorSubstrate (building)Materials scienceBar (music)Layer (electronics)

摘要: A stacked array embodiment (20) provides for efficient cooling of the diode bars (30, 30') and electrical connection between while maximizing alignment 30'). The spacers (26, 27, 28) are connected to a conductive surface (34) on heat spreader (24). In array, one or more alternated in series with two 28), circuit provided from bar (30'). Alternatively, thermally separator fins (38, 38') situated (26-28) contact promote rapid transfer diodes maintaining electrically isolated layer substrate

参考文章(31)
Thierry Fillardet, Eugene Leliard, Jean Pascal Duchemin, Eric Brousse, Semiconductor laser source ,(1996)
William Jeffrey Benett, David Carl Mundinger, Thin planer package for cooling an array of edge-emitting laser diodes ,(1992)
Meir Orenstein, Ann C. Von Lehmen, Planar array of vertical-cavity, surface-emitting lasers ,(1990)
Arye Rosen, John P. Kurmer, Douglas A. Wille, Light-activated series-connected pin diode switch ,(1987)
Barry L. Freitas, Jay A. Skidmore, Low-cost laser diode array ,(1996)
David L. Peterson, Multi-beam laser diode array ,(1990)
Rushikesh Patel, Michael Ung, Robert Morris, Laser diode array ,(1993)