Multi-zone heated esc with independent edge zones

作者: Vladimir Knyazik , Kyle Tantiwong , Samer Banna

DOI:

关键词: Plasma processingAcousticsDiffuser (thermodynamics)Base (geometry)Edge (geometry)WaferPlasma etchingUniform distribution (continuous)AzimuthMechanical engineeringMaterials science

摘要: An electrostatic chuck (ESC) with a cooling base for plasma processing chambers, such as etch chamber. In embodiments, includes plurality of independent edge zones. the zones are segments spanning different azimuth angles to permit temperature tuning, which may be used compensate other chamber related non-uniformities or incoming wafer non-uniformities. center zone having first heat transfer fluid supply and control loop, zones, together covering remainder area, each separate loops. diffuser, have hundreds small holes over area provide uniform distribution fluid.

参考文章(32)
Ralph Jan-Pin Lu, Paul Robertson, Tom Anderson, Eric A. Pape, Neil Benjamin, Keith William Gaff, Keith Comendant, Power switching system for esc with array of thermal control elements ,(2012)
Konstantin Makhratchev, Matthew James Busche, Senh Thach, Masanori Ono, Vijay D. Parkhe, Wendell Boyde, Pixelated cooling, temperature controlled substrate support assembly ,(2014)
Alexander Matyushkin, Theodoros Panagopoulos, Dan Katz, Michael D. Willwerth, John Holland, Substrate processing with rapid temperature gradient control ,(2007)
Hideyoshi Tsuruta, Yoshinobu Goto, Substrate heating device ,(2005)
Anthony Ricci, Keith Comendant, Keith William Gaff, Thermal plate with planar thermal zones for semiconductor processing ,(2011)
Louis P. Steinhauser, Jacob Robert Lindley, Allen Norman Boldt, Mohammad Nosrati, Kevin Robert Smith, Sanhong Zhang, Philip Steven Schmidt, Cal Thomas Swanson, Kevin Ptasienski, Dennis Stanley Grimard, High definition heater and method of operation ,(2012)
Alexander M. Veytser, Arnold Kholodenko, Semyon L. Kats, Surinder S. Bedi, Wing L. Cheng, Ananda H. Kumar, You Wang, Kadthala R. Narendrnath, Shamouil Shamouilian, Dennis S. Grimard, Electrostatic chuck bonded to base with a bond layer and method ,(2001)