Electronic component for aligning a light transmitting structure
作者： James H. Knapp , Francis J. Carney , Laura J. Norton
DOI:
关键词: Process (computing) 、 Layer (electronics) 、 Flip chip 、 Semiconductor device 、 Optical fiber 、 Materials science 、 Optoelectronics 、 Waveguide 、 Electronic component 、 Passivation
摘要: An electronic component (10) for aligning a light transmitting structure (19) such as an optical fiber or waveguide, includes semiconductor substrate (11) which contains supports at least one device (12). To provide electrical isolation and mechanical protection the (12), passivation layer (25) is disposed over (11). At alignment feature (14) provided The manufactured simultaneously during flip chip bump process eliminates necessity extra processing steps while providing additional functionality.
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