Solid annular gas discharge electrode

作者: George N. Steinberg

DOI:

关键词: Volumetric flow rateAnalytical chemistryWaferInertComposite materialChemistryMacorElectrodeElectric discharge in gasesChimneyInsulator (electricity)

摘要: Gas discharge apparatus (10) comprising an annular gas-emitting electrode (11) for use with wafer etching systems, and the like. The gas comprises a housing (12) having provisions cooling predetermined outer inner diameters secured to housing. An inert chimney (13) is disposed against face of adjacent its diameter (14) diameter. chimneys (13, 14) confine from face. insulator (15) that has opening (16) permits flow therethrough produce radially symmetric pattern. within centered relative (11). nonconducting components are typically made materials such as macor, magnesium oxide, fluoride, example. may be aluminum so it can water cooled, example, remove heat during etching, or directly cooled. introduces at center without causing any secondary discharge. Consequently, sufficiently high etch rates achieved. does not exhibit erosion effects very power rates. provides removal profile relatively spatial frequency which finer scale correction surfaces.

参考文章(9)
David H. Tracy, Donald L. Smith, Electrode for plasma etching system ,(1985)
Shigeki Tozawa, Shunichi Iimuro, Yoshikazu Ito, Hiromitsu Matsuo, Akira Nozawa, Kazushi Tomita, Motohiro Hirano, Yutaka Miura, Plasma etching system ,(1993)
Raymond L. Degner, Eric H. Lenz, Composite electrode for plasma processes ,(1990)
Michael Jung, Rudolf K. Faulhaber, Michael Geisler, Apparatus for the plasma treatment of substrates ,(1991)
Shunichi Iimuro, Yutaka Amemiya, Kimiharu Matsumura, Haruhiko Yoshioka, Kazutoshi Yoshioka, Hiroyuki Sakai, Keisuke Shigaki, Teruhiko Onoe, Method of ashing layers, and apparatus for ashing layers ,(1987)
Andreas G. Hegedus, Compound flow plasma reactor ,(1985)
Charles B. Zarowin, George N. Steinberg, Electrode assembly useful in confined plasma assisted chemical etching ,(1993)