Power Distribution Network Modeling and Analysis for TSV and Interposer-Based 3D ICs in the Frequency Domain

作者: Kiyeong Kim , Jun So Pak , Joungho Kim

DOI: 10.1007/978-94-017-9038-3_6

关键词: InterposerFrequency domainElectronic engineeringElectrical impedanceDecoupling capacitorCapacitanceDistribution networksComputer sciencePower (physics)

摘要: In this chapter, we treat the power distribution networks (PDNs) in TSV and interposer-based 3D ICs. First, introduce composition of PDNs conventional design methodology frequency domain. For PDNs, propose modeling method for ICs based on a segmentation method. By using models estimate analyze PDN impedance domain with respect to variations main issues such as size grid-type number power/ground (P/G) TSVs, capacitance on-chip decoupling capacitors (on-chip decaps).

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