作者: Kiyeong Kim , Jun So Pak , Joungho Kim
DOI: 10.1007/978-94-017-9038-3_6
关键词: Interposer 、 Frequency domain 、 Electronic engineering 、 Electrical impedance 、 Decoupling capacitor 、 Capacitance 、 Distribution networks 、 Computer science 、 Power (physics)
摘要: In this chapter, we treat the power distribution networks (PDNs) in TSV and interposer-based 3D ICs. First, introduce composition of PDNs conventional design methodology frequency domain. For PDNs, propose modeling method for ICs based on a segmentation method. By using models estimate analyze PDN impedance domain with respect to variations main issues such as size grid-type number power/ground (P/G) TSVs, capacitance on-chip decoupling capacitors (on-chip decaps).