Printed circuit board for harsh environments
作者： Andrew J. Burns , David J. Mitchell , Anand A. Kulkarni
DOI:
关键词: Footprint (electronics) 、 Gas turbines 、 Electrical engineering 、 Upstream (networking) 、 Optoelectronics 、 Printed circuit board 、 Engineering 、 Substrate (printing) 、 Layer (electronics) 、 Electrical conductor 、 Integrated circuit
摘要: A printed circuit board (PCB 22) capable of withstanding ultra high G forces and temperature as in a gas turbine (11). The PCB includes substrate having plurality cavities (30A, 36A) formed therein for receiving components circuit, conductors embedded the electrically connecting together to complete circuit. Each has wall (36A') upstream G-forces which supports respective component direct contact order prevent development tensile loads bonding layer (37A). When is an integrated (50), titanium con-ductors (63) are coupled between exposed ends pads on gold paste (51) may be inserted into interstitial gaps wall.
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