Thick film circuit board and method of forming wire bonding electrode thereon
作者： Kengo Oka , Takashi Nagasaka
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摘要: A gold (Au) thick film land constituting a wire bonding electrode is formed by printing and sintering paste previously added with copper (Cu) to overlap which as wiring layer on ceramic substrate. semiconductor part mounted the substrate are directly connected thereby electrically connecting film. In forming land, used. Therefore, disconnection caused Kirkendoll phenomenon restrained stable between can be achieved.
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