Printed circuit board having through-hole stopped with photo-curable solder resist
作者： Nobuyuki Yasuda , Hirohisa Amago , Nobuo Komatsu , Seimi Ishii
DOI:
关键词: Solder paste 、 Composite material 、 Electronic component 、 Materials science 、 Soldering 、 Resist 、 Substrate (printing) 、 Chip 、 Printed circuit board 、 Layer (electronics)
摘要: A printed circuit board having a through-hole in land is disclosed. solder resist of photo-curable formed on the substrate surface and stopped with same as layer. If which chip component mounted co-exists discrete mounted, only selectively resist. The layer stopping are by selective light exposure from both front reverse surfaces substrate.
lens.org 参考文章(3)
Heinz Rembold, Ewald Losert, Process for the production of solder masks for printed circuits ,(1978)
Edward J. Choinski, Method for temporarily sealing holes in printed circuit boards utilizing a thermodeformable material ,(1987)
Aran Jiei Nikoru, Richiyaado Daburiyuu Kuriagan, HORIZONTAL TWIN WIRE TYPE PAPERMAKING MACHINE ,(1989)