Reliability of ultra-thin silicon dioxide under substrate hot-electron, substrate hot-hole and tunneling stress

作者: Eric M. Vogel , Monica D. Edelstein , John S. Suehle

DOI: 10.1016/S0167-9317(01)00650-5

关键词: SemiconductorGate oxideOptoelectronicsSubstrate (electronics)Gate dielectricStress (mechanics)Materials scienceMOSFETSilicon dioxideQuantum tunnelling

摘要: Substrate hot-electron and substrate hot-hole injection experiments are used to provide insight into defect generation breakdown of ultra-thin silicon dioxide under constant voltage tunneling stress. Results from confirm that energetic electrons responsible for degradation stress conditions. suggest mechanisms other than trapping hot holes may be the dioxide.

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