Dual damascene structure with liner
作者： Baozhen Li , Chih-Chao Yang
DOI:
关键词: Electronic engineering 、 Trench 、 Substrate (printing) 、 Dual (category theory) 、 Materials science 、 Composite material 、 Layer (electronics) 、 Copper interconnect
摘要: A dual damascene structure with an embedded liner and methods of manufacture are disclosed. The method includes forming a in substrate. further reflowing seed layer such that material the flows into via structure. on over or within filling any remaining portions trench additional material.
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