Fabrication of Tungsten MEMS Structures
作者： John A. Geen , James Timony , Gregory S. Davis , Bruce Ma , Kenneth Flanders
DOI:
关键词: Etching (microfabrication) 、 Substrate (electronics) 、 Tungsten 、 Surface tension 、 Fabrication 、 Microelectromechanical systems 、 Nanotechnology 、 Layer (electronics) 、 Materials science
摘要: Thick (i.e., greater than two microns), fine-grained, low-stress tungsten MEMS structures are fabricated at low temperatures, particularly for so-called “MEMS last” fabrication processes (e.g., when after electronic circuitry is fabricated). Means very accurately etching structural details from the deposited layer and strongly stably anchoring to an underlying substrate disclosed. Also, means removing a sacrificial mobile without damaging or allowing it be drawn down stuck by surface tension
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