System and method for direct-bonding of substrates
作者： Charles C Haluzak , Arthur Piehl , Chien-Hua Chen , Jennifer Shih
DOI:
关键词:
摘要: A method of forming a MEMS (Micro-Electro-Mechanical System), includes an ambient port through cap which defines cavity containing plurality actuators therein; and bonding lid arrangement to the hermetically seal port.
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