作者: S.A. Sakwe , R. Müller , P.J. Wellmann
DOI: 10.1016/J.JCRYSGRO.2005.11.096
关键词:
摘要: Abstract We have developed a KOH-based defect etching procedure for silicon carbide (SiC), which comprises in situ temperature measurement and control of melt composition. As benefit the first time reproducible conditions were established (calibration plot, rate versus time); is independent, i.e. no altering KOH composition takes place, absolute values can be set. The paper describes this advanced furnace, including development new sensor resistant to molten KOH. present updated, parameters n-type SiC low highly p-type doped SiC, are used quantitative analysis. best recipes we found T = 5 3 0 ° C / min (activation energy: 16.4 kcal/mol) 13.5 kcal/mol) respectively.