Thermal processing system with cross-flow liner
作者： Martin Mogaard , Cole Porter , Bois Dale R Du , Jeff Bailey
DOI:
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摘要: An apparatus is provided for thermally processing substrates held in a carrier. The includes cross-flow liner to improve gas flow uniformity across the surface of each substrate. present invention longitudinal bulging section accommodate injection system. patterned and sized so that it conformal wafer carrier, as result, reduces gap between carrier reduce or eliminate vortices stagnation areas inner wall.
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