On-chip testing of embedded silicon transducers

摘要: System-on-chip (SoC) technologies are evolving towards the integration of highly heterogeneous devices, including hardware a different nature, such as digital, analog and mixed-signal, together with software components. Embedding transducers, predicted by technology roadmaps, is yet another step in this continuous search for higher levels miniaturisation. Embedded transducers fabricated silicon/CMOS compatible may have more limitations than fully dedicated technologies. However, they offer industry possibility providing low cost applications very large market niches, while still keeping acceptable transducer sensitivity. This case, example, accelerometers, micro-mirrors display devices or CMOS imagers. given fact that work signals other electrical, test these embedded parts poses new challenges. Test SoC rapidly maturing but many difficulties remain, particular addressing mixed-signal parts. In paper, we present our field MEMS (micro-electro-mechanical systems) on-chip testing brief overview state-of-the-art.