作者: Mehregany , K.J. Gabriel , W.S.N. Trimmer
DOI: 10.1016/0250-6874(87)80054-9
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摘要: … micro-structures are cut free from them silicon substrates, these s&con components can be used to burld a mde array of micro-… photograph of a 300 pm diameter gear after the RIE etch …