Sonic sensors and packages
作者： Klaus Elian , Horst Theuss
DOI:
关键词:
摘要: Embodiments relate to integrated sonic sensors having a transmitter, receiver and driver electronics in single, functional package. In one embodiment, piezoelectric signal silicon microphone controller/amplifier chip are concomitantly semiconductor housing. The housing, embodiments, is that at least portion of the housing can comprise element with an inlet aperture opposite receiver.
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