Grain boundary mobility during recrystallization of copper

作者: R. A. Vandermeer , D. Juul Jensen , E. Woldt

DOI: 10.1007/S11661-997-1002-9

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摘要: Average grain boundary migration rates during recrystallization of cold-deformed copper were estimated from stereological measurements. In the same material, instantaneous driving forces for calculated calorimetric measurements release stored energy cold work. The rate dependence on force was analyzed in context theory, and within experimental error, a linear observed. average mobility boundaries migrating cold-worked at 121°C to be 6.31×10−10 (m4 s−1 MJ−1). This result found consistent with single boundary, curvature-driven mobilities measured higher temperatures. It also demonstrated that reasonably expectation (order magnitude uncertainty) Turnbull process model akin self-diffusivity as rate-controlling atomic mechanism.

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