Computational analysis of the interfacial bonding between feed-powder particles and the substrate in the cold-gas dynamic-spray process

摘要: The cold-gas dynamic-spray process is analyzed by numerical modeling of the impact between a single spherical feed-powder particle and semi-infinite substrate. approach applied to copper‐aluminum system help explain experimentally observed higher deposition efficiencies copper on aluminum than ones associated with copper. To properly account for high strain, strain-rate deformation behavior two materials, appropriate linear-elastic rate-dependent, temperature-dependent, strain-hardening materials constitutive models are used. results obtained indicate that main factors contributing efficiency in case larger particle/substrate interfacial area contact pressures. Both these result kinetic energy heavier particle. character dominant bonding mechanism also discussed present paper. It argued an instability which can lead formation roll-ups vortices play significant role attaining strength bonding. # 2003 Elsevier Science B.V. All rights reserved.