Multi-channel backside wafer inspection
作者： Yakov Bobrov
DOI:
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摘要: A system for inspecting a backside surface of wafer with multi-channel focus control includes set inspection sub-systems including first sub-system positioned and an additional sub-system. The include optical assembly, actuation where the assembly is disposed on positional sensor configured to sense position characteristic between portion wafer. also controller acquire one or more profile maps adjust based received maps.
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