Formation of metal disilicide layers contacting ion beam-synthesized, buried 3C–SiC layers in silicon

作者: J.K.N. Lindner , S. Wenzel , B. Stritzker

DOI: 10.1016/S0169-4332(01)00680-8

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摘要: Abstract Large-area heteroepitaxial Si/SiC/Si structures can be formed by ion beam synthesis. In this paper, the conversion of Si top layer such into a metal disilicide contact high-dose titanium implantation is described. Rutherford backscattering spectroscopy, cross-sectional transmission electron microscopy, energy-filtered diffraction, X-ray scanning atomic force and electrical measurements are used to characterize resulting systems. It shown that proper adjustment dose—taking account sputtering rates Ti atoms—well-conductive textured C54–TiSi2 layers in single fabrication step. These structurally electrically stable up 900 °C or higher. The surface roughness determined grain size silicide controlled via temperature. at overly high doses, metal-rich silicides formed. case, diffusion from substrate metallization strain-induced macrodefects SiC thin film leads cavity formation lower SiC/Si interface.

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