Hermetically sealed chip carrier
作者： Dimitry Grabbe , Carmen Burns
DOI:
关键词:
摘要: A device for producing a hermetically sealed chip carrier is taught. Briefly stated, sealing or perimeter ring formed on substrate with an appropriate lead pattern and IC contained within this ring. Vias ducts are disposed in the metal pedestals therein which provide electrical connection through therefore between inside patterns outside of This allows continuous such that cap may be placed top bonded by methods as welding so to form enclosure.
lens.org 参考文章(13)
Carmen D. Burns, Copper-to-gold thermal compression gang bonding of interconnect leads to semiconductive devices ,(1975)
Carmen D. Burns, Antioxidant coating of copper parts for thermal compression gang bonding of semiconductive devices ,(1975)
Dimitry G. Grabbe, Electrical devices such as watches and method of construction thereof ,(1976)
John Francis Gogal, Double cavity semiconductor chip carrier ,(1981)
Ronald Patterson, Dimitry Grabbe, Lead frame and chip carrier housing ,(1979)
Mason John Jefferson, Transmission lines with a nickel-molybdenum-iron alloy sheath for de-icing ,(1965)
Carmen D. Burns, Tape operated semiconductor device packaging ,(1980)
James D. Mitchell, Copper conductor compositions containing copper oxide and Bi2 O3 ,(1978)
Carmen D. Burns, Process for hermetically encapsulating semiconductor devices ,(1980)
Ronald William Rigby, Electrical component assemblies with improved printed circuit construction ,(1968)