High speed bare chip test socket

作者: Dimitry G. Grabbe , Daniel R. Ringler , Iosif Korsunsky

DOI:

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摘要: An electrical socket (10) for interconnecting circuits on an integrated circuit chip to a substrate is disclosed. The includes base section (12), upper (16) and metallized plastic membrane (14) having traces (72) thereon. Contact pins (52) in the electrically connect inner ends (82) of outer (84) engage substrate.

参考文章(12)
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Dimitry Grabbe, Carmen Burns, Hermetically sealed chip carrier ,(1983)
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