Connector having contact modules for a substrate such as an IC chip carrier

摘要: Connector (2) for a substrate (6) such as an IC chip carrier comprises housing assembly (24) which in turn frame (26) and plurality of contact modules (48) on the (26). Each module has group members (66) therein. The are located predetermined positions within dimensional tolerances. have locating means (22, 44, 46) so that pads (4) will be registry with positions. Module (47, 57) also provided its own is directly related to 46). each thereby cumulative tolerances limited respective not beyond individual (48).