Electromigration Behavior of Eutectic SnPb Solder

摘要: Electromigration characteristics of eutectic SnPb solder were studied using thin stripe-type test structures. Significant changes in the microstructure observed after electromigration test, which temperature and current density varied from 80 to 100°C 4.6 8.7×104 A/cm2, respectively. While voids or local thinning found near cathode end, hillocks mainly anode end. From resistance measurements, it was calculated that activation energy for 0.77 eV. The dominant migrating element along electron flow at Pb.