Diagram of Electromigration Pattern in Eutectic Pb-Sn and Pb-Free Solders

摘要: Solder is the most frequently used alloy, which serves as bonding metal for electronics components. Recently, interconnected bump distinctly downsizing its bulk along with integration of high-density packaging. The evaluation electromigration damage solder bumps indispensable. Hence, it fairly urgent to understand mechanism be capable securing reliability and ultimately predicting failure lifetime. Electromigration pattern in multi-phase material determined by combination current density, temperature current-applying time. In this paper, diagram (DEP) solders presented, where both eutectic Pb-Sn Pb-free are treated. DEP gives basis discussing solders.