摘要: This paper presents a router that minimizes the amount of dummy fill necessary to satisfy requirements for chemical-mechanical polishing (CMP). The algorithm uses greedy strategy and effective cost functions control maximal pattern density during routing. On standard set benchmark circuits, our CMP-aware can reduce required by 22.0% on average, up 41.5%, as compared CMP-unaware case. In comparison with another routing approach, is demonstrated 14.1% 23.6%, over benchmarks.
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ispd.cc参考文章(14)
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