作者: B Henie , R Rudeloff , H Bolay , F Scholz
DOI: 10.1088/0268-1242/8/6/005
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摘要: The authors present a method for selective in situ etching and regrowth open stripes SiO2-covered InP substrates inside MOVPE reactor. medium was PCl2 which dissociated the reactor at temperatures between 400 degrees C 630 C. They investigated shape of grooves etched with respect to temperature crystallographic orientation by optical microscopy scanning electron (SEM). First experiments on regrown V have been done.