Enhanced Electrochemical Deposition with an Atomic Force Microscope

摘要: In-situ atomic force microscopy (AFM) is shown to locally enhance the electrochemical deposition of copper (Cu) onto single-crystal Cu surfaces. The tip sample interaction increases growth rate Cu, resulting in localized formation nanometer scale epitaxial deposits. results are consistent with a heterogeneous nucleation and mechanism which tip-sample creates surface defect sites passivating layer active toward adsorption species. This protection-deprotection scheme enables precise control feature sizes allows this technique be used for fabrication constructive modification solid-liquid interfaces. 25 refs., 4 figs.