Study of gold deposition on copper by electrochemical and microscopic techniques

摘要: Deposition of gold on copper from acid bath was investigated using electrochemical and microscopic techniques. The growth morphology both soft hard deposits characterized scanning electron microscopy (SEM) atomic force (AFM). Analysis chronoamperometric transients showed that the mechanism nucleation is three-dimensional progressive right-circular cones. This further confirmed by SEM AFM measurements. grain size deposit shown to be much smaller than gold, indicating nickel in acts as a refiner. mean roughness increases with deposition time, an increase negative potential --0.5 --0.70V (vs SCE), however, surface becomes more uniform at --0.80V. Similarly, maximum height clusters made between --0.50 --0.65V, while it decreases steeply potentials --0.65 inhibition crystal certain observed electrochemically corroborated