Solvent mixture with nitric acid and hydrofluoric acid for wet chemical etching of silicon

摘要: DESCRIBED IS A SOLVENT MIXTURE OF NITRIC ACID AND HYDROFLUORIC FOR WET CHEMICAL ETCHING SILICON OBJECTS. THE CHARACTERIZED BY INCORPORATION AT LEAST ONE ADDITION TO MIXTURE. THIS REACTS WITH NITROUS NITROGEN OXIDES PRESENT THROUGH EQUILIBRIUM OXIDE. ADDITIONS ARE PRIMARY OR SECONDARY ALIPHATIC AROMATIC AMINES, SIMPLE N-SUBSTITUTED AMIDES, HYDRAZINE HYDROXYLAMJINE, THEIR DERIVATIVES SALTS S-N COMPOUNDS WHICH CONTAIN=NH -NH2 GROUPS. ILLUSTRATORY CARBAMIDE, CYCLOHEXYLAMINE, GELATINE HYDRAZINE.