Heat-curable organopolysiloxane composition and adhesive

摘要: A heat-curable organopolysiloxane composition comprising: (A) a diorganopolysiloxane with both molecular chain terminals blocked hydroxyl groups, (B) an resin comprising monofunctional siloxane units and SiO 2 units, (C) compound having two or more allyloxycarbonyl groups (CH ═CHCH O(CO)—), allyl group-containing isocyanurate compound, and/or alkoxysilyl (D) curing agent is provided. The useful as adhesive which has adequate pressure-sensitive adhesion (stickiness) to substrate can be cured by short-time heat treatment show strong adhesion. preferably provided in the form of film.