Directly deposited fluxless lead-indium-gold composite solder
作者： C.Y. Wang , Y.C. Chen , C.C. Lee
DOI: 10.1109/33.273675
关键词:
摘要: Lead-indium-gold multilayer composite solder has been developed for bonding electronic devices without the use of flux. The is deposited directly on GaAs wafers in high vacuum to inhibit indium oxidation. gold layer further protects from oxidation atmosphere. Using flux, dies have successfully bonded alumina substrates at a process temperature 250 degrees C. Nearly perfect joints are achieved as verified by scanning acoustic microscope (SAM). Scanning electron microscopy (SEM) and energy-dispersive X-ray (EDX) spectroscopy results indicate that joint consists AuIn/sub 2/ grains embedded an In-Pb solid solution phase, predicted Au-In-Pb phase diagram. Thermal shock well shear tests confirm quality obtained with lead-indium-gold composite. >
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