Modified Face-Down Bonding of Ridge-Waveguide Lasers Using Hard Solder
作者： J.W.R. Teo , X.Q. Shi , S. Yuan , G.Y. Li , Z.F. Wang
关键词:
摘要: A modified face-down bonding technique of ridge-waveguide laser diodes (LDs) using 80Au20Sn solder has been performed. For ease of manufacturability, a bonding window …
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