Semiconductor laser apparatus and method for manufacturing same
作者： Takuma Motofuji , Teruaki Kasai , Kouji Oomori , Takayuki Yoshida , Naoto Ueda
DOI:
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摘要: The semiconductor laser device of the present invention has a conductive first heatsink member, adhesive, and element. adhesive is disposed on element adhesive. reaches an upper part side surface member under emission for structure further improves heat dissipation element; at same time, it effective in obtaining light from
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