Reliability potential of silicone molding compounds for LED application
作者： Yue Shao , Yu-chou Shih , Frank G. Shi
DOI: 10.4071/ISOM-TP34
关键词:
摘要: As the development of light emitting devices (LEDs), integrate circuits (ICs) and concentration photovoltaic (CPV) modules towards higher density, packaging materials are facing challenges withstand with heat generation high energy. Epoxy molding compound (EMC) is latest technology for LED solar cell package to replace PPA PCT. However, it well known that thermal radiation resistance epoxy limited. Recently, silicone based composites attracting attention as ideal because they insensible energy density good UV heat. both have reliability issues during long-term service at temperature Thermal degradation reflector will largely affect their reflectance contribution a output efficiency. Therefore, very essential evaluate performance SMC EMC reflecting materials. Aging under multip...
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