Inkjet printed dielectrics for electronic packaging of chip embedding modules
作者： Manfred Mengel , Ivan Nikitin
DOI: 10.1016/J.MEE.2009.08.033
关键词:
摘要: The inkjet printing of a dielectric layer as part an assembling process for semiconductor device was evaluated. This embeds chip so that space-saving package with surface conformal conductive paths instead wire bonds can be designed. Three different polymer solutions were tested whereas the polyimide ink is favored due to high thermal stability and strength printed layer. By multiple layers on top each other sufficient thickness cover edges well accurate contact holes realized.
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