Evaluation of Inkjet Technology for Electronic Packaging and System Integration
作者： Matti Mantysalo , Pauliina Mansikkamaki , Jani Miettinen , Kimmo Kaija , Seppo Pienimaa
关键词:
摘要: The main trend of the electronic packaging industry has been on increasing density and functionality, but now also interest flexible manufacturing grown. In this paper, we discuss utilization inkjet technology for system integration. Inkjet provides fully-additive non-contacting deposition method that is suitable production. demonstrate capability printable electronics through a highly-integrated RF SiP application, which manufactured partly by printing. contains discrete components an ASIC with minimum pitch 136 mum size pads 65 mum. width lines/spaces designed rule 75 mum/75 mum, narrower lines can be printed. depends properties surface, ink, drop volume. surface manipulated proper treatment. almost 20% decrease in diameter reported when treatment used.
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